Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/55899

Title

Laser-LIGA for Ni microcantilevers

Author(s)

Jin, Hengyi;  Harvey, Erol C.;  Hayes, Jason P.;  Ghantasala, Muralidhar K.;  Fu, Yao;  Jolic, Karlo;  Solomon, Matthew;  Graves, Kynan

Abstract

This paper presents our design and experimental results of nickel microcantilevers, which were fabricated using a laser-LIGA process, based on KrF (248 nm) excimer laser micromachining. A chrome-on-quartz mask, containing the desired mask patterns was prepared for this work. The substrate of copper (30 μm thick) clad printed circuit board (PCB) was laminated with Laminar 5038 photopolymer to be laser patterned. Following laser patterning and laser cleaning, all the samples were electroformed with nickel on top of the copper layer. To release the Ni microcantilevers, the excimer laser was employed again to remove the polymer in the localised area to facilitate Cu selective etching. Here, copper acted as the sacrificial layer as well. The Cu selective etching was carried out with ∼ 20 % (wt) aqueous solution of ammonium persulfate. Because the Cu selective etching is isotropic, some undercuts happened next to the anchor area. The samples were characterised using optical microscope, confocal laser scanning microscope and SEM, and some of Ni cantilevers were tested electro-thermally. Their performance was analyzed with respect to the simulation results.

Publication type

Conference paper

Research centre

Swinburne University of Technology. Industrial Research Institute Swinburne

Source

Proceedings of SPIE: 'Smart Structures, Devices and Systems', Melbourne, Australia, 16-17 December 2002 / E. C. Harvey, D. Abbott and V. K. Varandan (eds.), Vol. 4935, pp. 263-271

Publication year

2002

FOR Code(s)

0205 Optical Physics

Keyword(s)

Ammonium compounds;  Computer simulation;  Copper;  Copper sacrificial layer;  Electroforming;  Electrothermal;  Excimer lasers;  Mathematical models;  Microcantilevers;  Microelectromechanical devices;  Micromachining;  Laser-LIGA;  Nickel;  Nickel microcantilevers;  Printed circuit board;  Printed circuit boards

Publisher

SPIE

ISSN

0277-786X

Publisher URL

http://dx.doi.org/10.1117/12.476113

Copyright

Copyright © 2002 SPIE.

Peer reviewed