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An analysis of springback with bifurcation behavior and its application to die design
List of Titles
An analysis of springback with bifurcation behavior and its application to die design
Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/191790
- Title
- An analysis of springback with bifurcation behavior and its application to die design
- Author(s)
- Kim, J. B.; Yoon, J. W.; Yang, D. Y.
- Abstract
- Abstract not available.
- Publication type
- Conference paper
- Source
- Paper presented at the 9th International Conference on Technology of Plasticity (ICTP2008), Gyeongju, Korea, 07-11 September 2008
- Publication year
- 2008
- FOR Code(s)
- 0910 Manufacturing Engineering; 0913 Mechanical Engineering
- Keyword(s)
- Bifurcation behaviour; Die design; Springback
- Publisher
- Korean Society for Technology of Plasticity
- Copyright
- Copyright © 2008.
- Peer reviewed
