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Title

Three-dimensional modeling of the heat-affected zone in laser machining applications

Author(s)

Beresna, Martynas;  Gertus, Titas;  Tomasiunas, Rolandas;  Misawa, Hiroaki;  Juodkazis, Saulius

Abstract

Thermal load as well as its three-dimensional (3D) spatial distribution has been estimated inside representative materials: glass (low thermal diffusion), silicon (semimetal properties), and sapphire (a crystalline dielectric of a high thermal conductivity) for typical laser processing and direct laser writing applications. The 3D temperature distribution allows to calculate thermal stress around the focal region. This provides an assessment tool for optimization of laser microprocessing conditions for controlled laser dicing and cutting applications.

Publication type

Journal article

Source

Laser Chemistry, (2008) article no. 976205

Publication year

2008

FOR Code(s)

0205 Optical Physics

Keyword(s)

Direct laser writing;  Femtosecond lasers;  Heat;  Laser machining;  Laser processing;  Temperature;  Thermal stress

Publisher

Hindawi Publishing

ISSN

0278-6273

Publisher URL

http://dx.doi.org/10.1155/2008/976205

Copyright

Copyright © 2008 Martynas Beresna et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Full text

Peer reviewed