Study of bond strength for laser direct metal deposition of tool steel on copper alloy substrate

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Study of bond strength for laser direct metal deposition of tool steel on copper alloy substrate

Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/195666

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Title: Study of bond strength for laser direct metal deposition of tool steel on copper alloy substrate
Author(s): Imran, M. K.; Masood, S. H.; Song, W. Q.; Brandt, Milan
Abstract: This paper presents an investigation on laser direct metal deposition of tool steel on copper alloy substrate both directly and using high nickel stainless steel as buffer layer. The bond strength between the clad and the substrate has been investigated. Tensile testing was employed to measure the bond strength. The characteristics of the fracture surfaces have also been analyzed. Bond strength measurement revealed that the ultimate tensile strength of the substrate material was higher compared to the bond strength between the clad and the substrate. In addition, the experimental result revealed that use of high nickel stainless steel reduced the bond strength with substrate. However, the bond strength measured in this experiment between laser cladded tool steel and copper alloy substrate was much higher compared to the bond strength between these two metals coated using other techniques.
Publication type: Journal article
Research centre: Swinburne University of Technology. Faculty of Engineering and Industrial Sciences. Industrial Research Institute Swinburne
Source: Advanced Materials Research: Frontiers of Manufacturing Science and Measuring Technology: selected papers from the 2011 International Conference on Frontiers of Manufacturing Science and Measuring Technology (ICFMM 2011), Chongqing, China, 23-24 June 2011 / Ran Chen and Wenli Yao (eds.), Vol. 230-232, pp. 945-948
Publication year: 2011
FOR Code(s): 0912 Materials Engineering
Keyword(s): Bond strength; Direct metal deposition; Fracture morphology; Tensile test
Publisher: Trans Tech Publications
ISSN: 1022-6680 (series ISSN)
ISBN: 9783037851333, 3037851333
Publisher URL: http://dx.doi.org/10.4028/www.scientific.net/AMR.230-232.945
Peer reviewed