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Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/2442
- Fabrication of multilayered microfluidic 3D polymer packages
- Atkin, Micah J.; Garst, Sebastiaan; Harvey, Erol C.; Schuenemann, Matthias; Solomon, Matthew D.
- The realization of microfluidic packages by stacking and bonding several layers of microstructured polymer films opens up the potential of creating complex three-dimensional microfluidic structures based on relatively simple two-dimensional manufacturing processes. Whereas a multitude of microstructuring techniques have been developed, packaging and bonding technologies for multilayer microfluidic devices are still underrepresented. Bulk bonding processes like thermal diffusion bonding fit well into a lab environment, but feature extensive bonding times. With increasing fluidic complexity, bonding technologies that enable selective bonding and sealing at pre-selected areas (e.g. around channel walls or process chambers) are required. Selective bonding technologies enable a localized heat generation exactly at the desired bond position and thus significantly reduce the risk of structure deformation and channel clogging. In this paper, experimental results for a variety of bulk and selective bonding methods are reported and compared. Surface modification of polymers and lasers welding of polymer sheets are identified as suitable technologies for integration with high-throughput production environments.
- Publication type
- Conference paper
- Research centre
- Swinburne University of Technology. Faculty of Engineering and Industrial Sciences
- Proceedings of the 55th Electronic Components & Technology Conference ECTC 05, 31 May - 3 June 2005, Lake Buena Vista, Florida, USA, pp. 603-610
- Publication year
- Institute of Electrical and Electronics Engineers
- Publisher URL
- ©2005 IEEE