Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/210519

Title

Effect of rapid curing doped epoxy adhesive between two polycarbonate substrates on the bond tensile strength

Author(s)

Soesatyo, Bambang;  Blicblau, Aaron;  Siores, Elias

Abstract

The aim of this work was to determine the bond tensile strength of a polycarbonate sandwich joined with a fast cured epoxy adhesive. A 6.5 kW single mode microwave unit operating at 2.5 GHz was used to fast cure the epoxy adhesive. The samples of polycarbonate were prepared in accordance with ASTM D2095-72 (modified) and glued with a two-part epoxy adhesive mix employing a doping agent for rapid cure in the microwave unit. Two operational parameters, cure time, microwave power and one processing parameter, dopant concentration, were varied to determine their effect on the resulting bond strength. These rapidly-cured samples were then tensile tested to determine the joint strength as a function of the operational and processing parameters. The fracture surfaces of the adhesively joined polycarbonate samples were examined using light microscopy and scanning electron microscopy. A polariscope was employed to determine the variation in stress in the adhesive joint. Conventional curing of epoxy adhesive polycarbonate sandwiches was also undertaken. The tensile strength of these conventionally-cured bonded samples were then compared to that of fast cure using microwave. Results of the processing and testing program indicate the effect of dopant concentration, curing time and microwave absorbed power on the resulting mechanical strength of the adhesively bonded joint.

Publication type

Journal article

Research centre

Swinburne University of Technology. School of Engineering and Science

Research centre

Swinburne University of Technology. Industrial Research Institute Swinburne

Source

Journal of Materials Processing Technology: incorporating the proceedings of the 4th Asia Pacific Conference on Materials Processing, Singapore, 19-20 May 1999, Vol. 89-90 (May 1999), pp. 451-456

Publication year

1999

FOR Code(s)

0910 Manufacturing Engineering;  0912 Materials Engineering;  0913 Mechanical Engineering

Keyword(s)

Additives;  Adhesive joining;  Bond tensile strength;  Bonding;  Curing;  Epoxy resins;  Fracture;  Microwaves;  Photostress;  Polariscopes;  Polycarbonates;  Scanning electron microscopy;  Single mode microwave unit;  Stresses;  Surfaces;  Tensile strength

Publisher

Elsevier

ISSN

0924-0136

Publisher URL

http://dx.doi.org/10.1016/S0924-0136(99)00026-6

Copyright

Copyright © 1999 Elsevier Science S.A. All rights reserved.

Peer reviewed