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- Glass cutting by femtosecond pulsed irradiation
- Vanagas, Egidijus; Kawai, Jouji; Tuzhilin, Dmitrii; Kudryashov, Igor; Mizuyama, Atsushi; Nakamura, Kazutaka G.; Kondo, Ken-Ichi; Koshihara, Shin-ya; Takesada, Masaki; Matsuda, Kazunari; Juodkazis, Saulius; Jarutis, Vygandas; Matsuo, Shigeki; Misawa, Hiroaki
- We report on quartz and glass cutting by a lateral scanning of femtosecond pulses (150 fs at 1 kHz repetition rate) of 800 nm wavelength at room and low pressure (5 Torr) air ambience. Pulses were focused by a low numerical aperture (NA < 0.1) objective lens. Optimization of fabrication conditions: pulse energy and scanning speed were carried out to achieve large-scale (millimeter-to-centimeter) cutting free of microcracks of submicron dimensions along the edges and walls of the cut. Cutting through out the samples of 0.1-0.5 mm thickness was successfully achieved without apparent heat affected zone. At low air pressure (5 Torr) ambience, redeposition of ablated material was considerably reduced. It is demonstrated that the damage on the rear surface was induced by the stress waves, which originated from the plasma ablation pressure pulse. The mechanism of femtosecond-laser cutting of transparent materials at high irradiance and the influence of stress waves generated by plasma plume are discussed.
- Publication type
- Journal article
- Journal of Microlithography Microfabrication and Microsystems, Vol. 3, no. 2 (Apr 2004), pp. 358-363
- Publication year
- Ablation; Femtosecond laser microfabrication; Glass cutting; Glass dicing; Quartz cutting; Quartz dicing
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- Copyright © 2004 Society of Photo-Optical Instrumentation Engineers. This paper was originally published in Journal of Microlithography Microfabrication and Microsystems (Vol. 3, no. 2), and is available from: http://dx.doi.org/10.1117/1.1668274. The published version of the paper is reproduced here in accordance with the copyright policy of the publisher. One print or electronic copy may be made for personal use only. Systematic electronic or print reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
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