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Title

Laser micro-fabrication/manipulation of dielectric materials

Author(s)

Misawa, Hiroaki;  Juodkazis, Saulius;  Marcinkevicius, Andrius;  Mizeikis, Vygantas;  Yamaguchi, Akira;  Sun, Hongbo;  Matsuo, Shigeki

Abstract

We describe microfabrication of various materials by multi-photon absorption (MPA) of femtosecond (120-150 fs) light pulses. The photo-modification at the focal point of tightly focused laser beam occurs inherently within volume smaller than that defined by the diffraction limit. The achievable lateral resolution is compared with that obtainable by lithography which uses near-field optical microscopy (NSOM). This technique can in principle lead to the realization of 3D optical memory and photonic crystals (PhC) with arbitrary lattice in polymers and silica glass, 3D prototyping in polymerizable resins, and etching of 3D structures guided by the optically damaged pattern in silica. Another topic also discussed in this work deals with laser micromanipulation using continuos wave (cw) laser operating at 1.06 mum. Light-controlled revolution of liquid crystal droplet and volume-phase transition of gel will be described.

Publication type

Conference paper

Source

Proceedings of the 2000 International Symposium on Micromechatronics and Human Science (MHS 2000), Nagoya, Japan, 22-25 October 2000, pp. 23-33

Publication year

2000

Keyword(s)

Microfabrication;  Nearfield optical microscopy;  Photonic crystals;  Photo-polymerization;  Three-dimensional optical memory

Publisher

IEEE

ISBN

9780780364981, 0780364988

Publisher URL

http://dx.doi.org/10.1109/MHS.2000.903278

Copyright

Copyright © 2000 IEEE. Published version of the paper reproduced here in accordance with the copyright policy of the publisher. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

Full text

Peer reviewed