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Residual stresses and deformations in electron beam melting process using finite element analysis
List of Titles
Residual stresses and deformations in electron beam melting process using finite element analysis
Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/240071
- Title
- Residual stresses and deformations in electron beam melting process using finite element analysis
- Author(s)
- Mohammadhosseini, Afshin; Masood, S. H.; Fraser, Darren; Jahedi, Mahnaz
- Abstract
- The simulation of residual stress in Electron Beam Melting (EBM) process is critical for optimization of process conditions. However, there is no published literature on the simulation of residual stresses in this process. This paper considers finite element modeling of the temperature distribution through transient thermal analysis. The measured temperature and total heat flux from transient thermal analysis are then used as initial input parameters to the structural analysis. Consequently, deformations and residual stresses in structural analysis were measured. The titanium alloy, Ti6Al4V has been used, which is one of the most common materials for biomedical implants due to its high strength to weight ratio, corrosion resistance, and its biocompatibility features.
- Publication type
- Journal article
- Research centre
- Swinburne University of Technology. Faculty of Engineering and Industrial Sciences
- Source
- Advanced Materials Research: Advances in Manufacturing and Materials Engineering: selected papers from the International Conference on Advances in Manufacturing and Materials Engineering (ICAMME 2012), Kuala Lumpur, Malaysia, 03-05 July 2012, Vol. 576, pp. 789-792
- Publication year
- 2012
- FOR Code(s)
- 0912 Materials Engineering
- Keyword(s)
- Deformation behavior; EBM; Electron beam melting; FEA; Finite element analysis; Rapid manufacturing; Residual stress; Titanium
- Publisher
- Trans Tech Publications
- ISSN
- 1022-6680 (series ISSN)
- ISBN
- 9783037854983, 3037854987
- Publisher URL
- http://dx.doi.org/10.4028/www.scientific.net/AMR.576.789
- Copyright
- Copyright © (2012) Trans Tech Publications, Switzerland.
- Peer reviewed


