Search Swinburne Research Bank
Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/5921
|Download PDF (Published version) (Adobe Acrobat PDF, 3 MB)|
- Thermal analysis of micro-pipe laden substrate in thermoelectric micro-coolers
- Abbas Abidi, Faisal; Masood, Syed H.
- With the increase in the chip packaging density the amount of heat generated from them has also increased considerably. Conventional cooling techniques are not well suited to solve the thermal problems that are arising as a result of this miniaturization of power microelectronic devices. We have developed a novel assembly of micro-pipe laden heat conducting substrate and thick film thermoelectric micro-cooler to deal with this issue. This paper presents the description of the novel micro-cooler fabrication technique and the results of the thermal analysis done on the micro-pipe laden substrate using the Pro/Mechanica thermal simulation package for varying performance factors.
- Publication type
- Conference paper
- Research centre
- Swinburne University of Technology. Faculty of Engineering and Industrial Sciences. Industrial Research Institute Swinburne
- Proceedings 31st International Conference on Electronics Manufacturing and Technology (IEMT 2006), Malaysia, 08-10 November 2006, pp. 67-72
- Publication year
- Cooling; Chip scale packaging; Assembling; Integrated circuits; Thermal analysis; Thermoelectric devices
- Publisher URL
- Copyright © 2006 IEEE. Paper reproduced in accordance with the copyright policy of the publisher. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
- Full text
- Peer reviewed