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Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/39715
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- Development of packaging systems and interconnects for microfluidics applications
- Liu, Tony; Masood, Syed H.; Iovenitti, Pio G.; Harvey, Erol C.
- The objective of this research program is to develop effective packaging techniques and methodologies for selected micro-electro-mechanical systems (MEMS) used in microfluidics applications. The developed packaging system will be aimed at standardising the process of packaging for most of the microfluidics devices including microfluidic edge connectors and manifold dispensers, and their development will include the use of rapid prototyping technologies such as Fused Deposition Modelling. The work will be aimed at reducing the overall time and cost of developing and assembling the packaging system for microfluidics devices. The consideration of designs for polymer microfluidic connections and packaging will be described in this paper.
- Publication type
- Conference paper
- Research centre
- Swinburne University of Technology. Industrial Research Institute Swinburne
- Profiles in Industrial Research: Knowledge and Innovation 2002, St Kilda, Victoria, Australia, 15-19 July 2002, pp. 236-242
- Publication year
- Fused deposition modelling; MEMS; Micro electromechanical systems; Packaging techniques
- Industrial Research Institute Swinburne, Swinburne University of Technology
- Publisher URL
- Copyright © 2002 the authors.
- Additional information
- The authors would like to thank the CRC for microTechnology for providing funding and support for this project. They also acknowledge support form colleagues in microTechnology for their advices and suggestions.
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