Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.3/41612

Title

Effects of vacuum plasma spray processing parameters on splat morphology

Author(s)

Montavon, Ghislain;  Sampath, Sanjay;  Berndt, Christopher C.;  Herman, Herbert;  Coddet, Christian

Abstract

Several statistical tools (i.e., Gaussian and Weibull distribution analyses, the t-test, and analysis of the variance) were used to examine relationships between vacuum plasma spray processing parameters and the morphology of flattened particles (splats) on a smooth, polished substrate. Astroloy, a nickel-base powder, was vacuum plasma sprayed onto polished copper substrates under various processing conditions. Differential flattened particle shape factors, including equivalent diameter, elongation factor, and degree of splashing, were determined using image analysis. The spray parameters (i.e., current intensity, chamber pressure, argon mass flow rate, etc.) strongly influenced splat formation and morphology and thus deposit microstructure and properties.

Publication type

Journal article

Source

Journal of Thermal Spray Technology, Vol. 4, no. 1 (Mar 1995), pp. 67-74

Publication year

1995

Keyword(s)

Copper;  Degree of splashing;  Elongation factor;  Flattened particles;  Image analysis;  Microstructure;  Morphology;  Nickel;  Particle size analysis;  Particles;  Particulate matter;  Plasma spraying;  Polished substrate;  Splat morphology;  Spray parameters;  Statistical methods;  Substrates;  Vacuum plasma spray processing;  Vacuum technology;  Weibull distribution

Publisher

Springer

ISSN

1059-9630

Publisher URL

http://dx.doi.org/10.1007/BF02648530

Peer reviewed